prov:value
| - As circuit densities increase, the widths of interconnects, such as vias, trenches, contacts, and other features, as well as the dielectric materials between, decrease to sub-micron dimensions (e.g., 0.20 micrometers or less), whereas the thickness of the dielectric layers remain substantially constant, with the result of increasing the aspect ratios (i.e., height divided by width) of the features
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