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  • FIG. 11A is a plane view illustrative of a semiconductor laser device provisionally placed on the AuSn amorphous alloy solder bumps on the solder bonding pads provided on the silicon wafer-board in a process of provisionally placing the semiconductor laser device onto the AuSn amorphous alloy solder bumps on the solder bonding pads provided on the silicon wafer-board in a third embodiment in accor
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