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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • Metallic materials (for example such as Ti, TiN, Pt, Al, Au, W, Ni, In, Sn, InPb, SnPb) that form the metallic interconnection pads, sealing beads and their sockets, are deposited by cathodic sputtering, chemical vapour deposition or evaporation.
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