BRIEF DESCRIPTION OF THE DRAWINGS [0022]FIGS. 1A and 1B are a plan view and a cross sectional view of a semiconductor device according to a first embodiment of the invention. [0023]FIGS. 2A to 2H are cross sectional views illustrating the manufacture processes of a semiconductor device according to the first embodiment of the invention. [0024]FIG. 3 is a plan view corresponding to the cross sectio