FIGS. 42A and 42B are cross-sectional view showing the left half of a variation of a lead frame of a conventional LGA, a plan view showing a quarter of the lead frame of the variation of the conventional LGA, respectively, and FIGS. 42C and 42D are a cross-sectional view showing the left half of a lead frame used in a variation of the resin-encapsulated semiconductor device of this embodiment, and