Description
Metadata
Settings
owl:sameAs
Inference Rule:
b3s
b3sifp
facets
http://www.w3.org/2002/07/owl#
ldp
oplweb
skos-trans
virtrdf-label
None
About:
isa:79742186
Sponge
Permalink
An Entity of Type :
prov:Entity
, within Data Space :
webisadb.webdatacommons.org
associated with source
dataset(s)
Type:
prov:Entity
New Facets Session with This Class
Attributes
Values
rdf:type
prov:Entity
prov:value
Because solder alloys cannot wet or bond to semiconductor materials such as silicon and ceramics, solder wafer bonding requires solderable bond pads adhered to each wafer and to which the solder will metallurgically bond.
prov:wasQuotedFrom
google.com
is
prov:wasDerivedFrom
of
isap:44773496
isap:45356706
Alternative Linked Data Views:
ODE
Raw Data in:
CXML
|
CSV
| RDF (
N-Triples
N3/Turtle
JSON
XML
) | OData (
Atom
JSON
) | Microdata (
JSON
HTML
) |
JSON-LD
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