This process will be described in greater details. [0170]FIGS. 23A and 23B are a cross-sectional view and a plan view illustrating the resin encapsulation process shown in FIG. 22D, respectively. [0171] As shown in FIG. 23A, in the resin encapsulation process, the resin-encapsulated semiconductor device that has been subjected to all the processes up to that shown in FIG. 22C is set in molds 206 a