When the present invention is applied on the internal line of the package substrate, a dielectric layer (not shown) can be further disposed on the upper surface 422 of the dielectric layer 420 and the partial surfaces 412 a, 412 b, 412 c of the lines 410 a, 410 b, 410 c, and other lines are sequentially generated above the dielectric layer (not shown), such that a multilayer circuit substrate is f