e metal thin wires in the resin-encapsulated semiconductor device of the first embodiment. [0066]FIGS. 22A to 22E are cross-sectional views showing a production process sequence of the resin-encapsulated semiconductor device of the first embodiment. [0067]FIGS. 23A and 23B are a cross-sectional view and a plan view illustrating the resin encapsulation process shown in FIG. 22D, respectively. [0068