{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/157218708"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Alternatively, the integrated circuit package system 800 could be electrically attached to the structure 900 by surface mount technology, such as ball grid array and flip-chip technology." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/257600627"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/157218708" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/400388115"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/157218708"] } } }
