{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/161395786"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "td.Semiconductor package and methods of manufacturing the sameUS8420952Jul 20, 2011Apr 16, 2013Kyocera CorporationCircuit board, electronic device including a circuit board, and method of manufacturing a circuit boardUS20110122592 *Nov 24, 2009May 26, 2011Sanka GanesanFirst-level interconnects with slender columns, and processes of forming same* Cited by examinerClassifications U.S. Classification" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/159891650"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/161395786" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/397891955"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/161395786"] } } }
