{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/174570859"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "A long-established premier provider of wafer bonding, alignment and handling equipment to MEMS-focused customers in industry as well as academia ??? 27 of the world???s top 30 MEMS manufacturers use its equipment ??? EVG has leveraged its success in this arena to migrate into key emerging technologies, including 3D ICs and light-emitting diodes (LEDs)." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "evgroup.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/265336111"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/174570859" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/238592109"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/174570859"] } } }
