{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/177769270"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Also, FIGS. 18A and 18B are a side view and a rear view of an IC chip prior to a bonding step of an IC chip mounting method according to a prior art example for explaining the eighth embodiment, and FIG. 19 is a side view of the IC chip, a circuit board, and a bonding, material during the bonding step of the prior art example." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.de" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/248349209"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/177769270" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/169308978"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/177769270" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/250979933"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/177769270"] } } }
