{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/206085906"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Sputtering describes a number of physical techniques commonly used in, for example, the semiconductor industry for the deposition of thin films of various metals such as aluminum, aluminum alloys, refractory metal suicides, gold, copper, titanium-tungsten, tungsten, molybdenum, tantalum, indium-tin-oxide (ITO) and less commonly silicon dioxide and silicon on an item (a substrate), for example a wa" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/227412945"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/206085906" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/2120378"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/206085906"] } } }
