{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/218240144"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "This contrasts with arrangements wherein the interconnection substrate (which may be silicon) is purely a support structure for other active chips, or for passive devices such as inductors or capacitors." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/137763995"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/218240144" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/482463090"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/218240144"] } } }
