{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/266159516"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "One example of the method is providing a carrier layer surface, coating at least a portion of the carrier layer surface with a sacrificial layer, attaching a substrate layer to the sacrificial layer, wherein the substrate layer supports at least a component of the electronic device, patterning a plurality of sacrificial layer access openings through the substrate layer, and releasing the substrate" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/272082044"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/266159516"] } } }
