{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/278489264"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Alternatively, a metal interconnection and the underlying plug or via may comprise a conventional dual damascene copper interconnection (which may further include an adhesive and/or diffusion barrier layer, such as a tantalum nitride-on-tantalum bilayer, and a seed layer such as sputtered copper, ruthenium or other metal, between it and the surrounding dielectric layer)." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/13059316"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/278489264"] } } }
