{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/287716846"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "The chip-scale package is a relatively new packaging technology, in which a semiconductor die is bonded to a substrate, such as plastic or ceramic, and the substrate is about the same size as the semiconductor die, or more specifically, slightly larger than the semiconductor die." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/316406426"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/287716846" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/319838934"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/287716846"] } } }
