{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/304236513"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "The forming method of the stackingstructure according to the invention is applied to the creation of the stacking structure comprising the lower wirings which are in come into contact with the substrate and the insulative layer arranged thereon.The electroconductive paste which is used in the invention is a kneading substance which is made of at least the resin component, the electroconductive fin" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "patentgenius.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/351711534"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/304236513"] } } }
