{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/321289243"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "After the via holes have been fashioned in the various layers, the vias are then formed in the via holes by depositing one or more electrically conductive materials, such as copper or the like, into the via holes." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/98962643"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/321289243" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/455181460"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/321289243"] } } }
