{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/343511767"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "In doing so, these techniques can cause problems such as debris, damage to the device and loss of precious semiconductor material.A laser technique called stealth dicing can overcome these problems by cutting the wafer from the inside." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "photonics.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/449428746"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/343511767"] } } }
