{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/386325969"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Additionally, there is need for a semiconductor circuit and an economically feasible design and fabrication method so that it is capable of improving substantially reducing crosstalk.In addition, there is a need for a front-side illuminated, back-side contact (FSL-BSC) photodiode arrays having superior characteristics, including low manufacturing cost via thermal budget processing; low crosstalk e" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "freepatentsonline.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/332887694"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/386325969"] } } }
