{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/388089274"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Such a conductive plug 430 filling a via hole (trench) is typically formed by forming an opening through the dielectric oxide by conventional photolithographic and etching techniques, and filling the opening with a conductive material such as tungsten ???W???." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/472452492"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/388089274"] } } }
