{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/430369933"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "DESCRIPTION OF RELATED ART [0002] Within the context of the instant invention is a chip or microarray-shaped carrier is a substrate, in particular a glass or silicon chip diced from a wafer and printed as a semiconductor device." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/290280992"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/430369933" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/337149347"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/430369933"] } } }
