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PrefixNamespace IRI
n4google.
isaphttp://webisa.webdatacommons.org/prov/
isahttp://webisa.webdatacommons.org/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
provhttp://www.w3.org/ns/prov#
xsdhhttp://www.w3.org/2001/XMLSchema#
Subject Item
isa:143261974
rdf:type
prov:Entity
prov:value
In this case, underfill resin is applied to the bumped sides of IC chips, preferably at wafer level, before the chips have been bonded to an interconnect substrate such as a printed circuit board (PCB).
prov:wasQuotedFrom
n4:com
Subject Item
isap:263717575
prov:wasDerivedFrom
isa:143261974