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n4google.
isaphttp://webisa.webdatacommons.org/prov/
isahttp://webisa.webdatacommons.org/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
provhttp://www.w3.org/ns/prov#
xsdhhttp://www.w3.org/2001/XMLSchema#
Subject Item
isa:257911230
rdf:type
prov:Entity
prov:value
With a view to avoiding formation of condensate in connection with the cooling process, the housing is fixed against the printed circuit board according to the invention, a sealing material, such as butyl, being arranged between the housing (15) and the printed circuit board (3).
prov:wasQuotedFrom
n4:es
Subject Item
isap:292801609
prov:wasDerivedFrom
isa:257911230