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Subject Item
isa:269942386
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An encapsulant 110 (shown in FIG. 1B), which may be an epoxy, mold compound, or other encapsulating material, covers IC die 102 and bond wires 108 for mechanical and environmental protection.
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n4:com
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isap:57689155
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isa:269942386
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isap:292921973
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