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To prevent this, the adhesion layer 54 made of a metal such as Ti or Ta or an oxide (e.g. TiOx, TaOx) or a nitride (e.g. TiNx, TaNx) of these metals is arranged between the lower electrode 55 and the interlayer dielectric film 52, thus improving the adhesion of the lower electrode 55 to the underlying dielectric film.
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