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ew showing the manufacturing method of the semiconductor device according to the first embodiment; [0014]FIGS. 4A and 4B are a sectional view and plan view showing the vicinity of a dummy wire of the semiconductor device according to the first embodiment; [0015]FIGS. 5A and 5B are sectional views showing peels of insulating films inside a layer or between layers according to a conventional techniq
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