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-Packard CompanyIncreasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperatureUS5516727Jan 20, 1995May 14, 1996International Business Machines CorporationMethod for encapsulating light emitting diodesUS5519720Jan 5, 1994May 21, 1996Mitsubishi Denki Kabushiki KaishaSemiconductor light emitting deviceUS5526229Jul 1, 1992Jun 11, 1996Seiko Epson Corporat
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