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5Masunaga Menlo Park Co., Ltd.Property of bonded metal, including forming material of nickel-titatium alloy, and the method of manufacturing the sameUS5597470Jun 18, 1995Jan 28, 1997Tessera, Inc.Method for making a flexible lead for a microelectronic deviceUS5599468Oct 3, 1994Feb 4, 1997Frederick M. MakoPulsed electron beam joining of materialsUS5687995May 10, 1996Nov 18, 1997Hitachi, Ltd.Shape me
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