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ctor to the glass plate surface can be made high. (Ts???T90) is more preferably from 0.1 to 50?? C.As mentioned below, the melting temperature Ts of the glass frit is preferably from 450 to 500?? C. In such a case, T100 of the present binder resin is preferably from 420 to 450?? C. In such as case, when T100 is at least 420?? C., it is possible to prevent complete decomposition of the present bind
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