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PrefixNamespace IRI
n4google.
isaphttp://webisa.webdatacommons.org/prov/
isahttp://webisa.webdatacommons.org/
rdfhttp://www.w3.org/1999/02/22-rdf-syntax-ns#
provhttp://www.w3.org/ns/prov#
xsdhhttp://www.w3.org/2001/XMLSchema#
Subject Item
isa:79742186
rdf:type
prov:Entity
prov:value
Because solder alloys cannot wet or bond to semiconductor materials such as silicon and ceramics, solder wafer bonding requires solderable bond pads adhered to each wafer and to which the solder will metallurgically bond.
prov:wasQuotedFrom
n4:com
Subject Item
isap:44773496
prov:wasDerivedFrom
isa:79742186
Subject Item
isap:45356706
prov:wasDerivedFrom
isa:79742186