<http://webisa.webdatacommons.org/100676408>	<http://www.w3.org/ns/prov#value>	"The semiconductor component can comprise a package, a die, or a wafer configured for surface mounting to a supporting substrate, such as a printed circuit board, to form an electronic assembly." .
<http://webisa.webdatacommons.org/100676408>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/100676408>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/334813002>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/100676408> .