<http://webisa.webdatacommons.org/prov/447138768>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/101337482> .
<http://webisa.webdatacommons.org/101337482>	<http://www.w3.org/ns/prov#value>	"The present invention relates to carrier assemblies, polishing machines including carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces." .
<http://webisa.webdatacommons.org/101337482>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/101337482>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .