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<http://webisa.webdatacommons.org/prov/353356681>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/101443248> .
<http://webisa.webdatacommons.org/101443248>	<http://www.w3.org/ns/prov#value>	"The semiconductor device described in claim 4 wherein the substrate is a flexible insulating substrate, and that the conductor leads include the conductor pattern formed on the flexible insulating substrate and the solder bumps electrically connected to the conductor pattern." .
<http://webisa.webdatacommons.org/101443248>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .