<http://webisa.webdatacommons.org/101745754>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/62320232>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/101745754> .
<http://webisa.webdatacommons.org/101745754>	<http://www.w3.org/ns/prov#value>	"Bond wires of gold, aluminum or other suitable materials as known in the art are attached between the upper die bond pads and a corresponding trace end or lead end on the substrate." .
<http://webisa.webdatacommons.org/101745754>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .