<http://webisa.webdatacommons.org/103018910>	<http://www.w3.org/ns/prov#value>	"FIG. 12A is an enlarged cross-sectional view of a packaged semiconductor device in accordance with an embodiment of the present invention; and" .
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<http://webisa.webdatacommons.org/103018910>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .