<http://webisa.webdatacommons.org/103160671>	<http://www.w3.org/ns/prov#value>	"FIG. 12 is a process drawing showing another embodiment of the producing method of multilayer circuit board of the present invention, wherein:" .
<http://webisa.webdatacommons.org/103160671>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/232326698>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/103160671> .
<http://webisa.webdatacommons.org/103160671>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .