<http://webisa.webdatacommons.org/103538234>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/103538234>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/103538234>	<http://www.w3.org/ns/prov#value>	"An important packaging process is that of mounting and electrically connecting a semiconductor die to a mounting substrate such as a printed circuit board." .
<http://webisa.webdatacommons.org/prov/334813002>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/103538234> .