<http://webisa.webdatacommons.org/prov/26536812> <http://www.w3.org/ns/prov#wasDerivedFrom> <http://webisa.webdatacommons.org/104203271> . <http://webisa.webdatacommons.org/104203271> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/ns/prov#Entity> . <http://webisa.webdatacommons.org/104203271> <http://www.w3.org/ns/prov#wasQuotedFrom> <google.es> . <http://webisa.webdatacommons.org/104203271> <http://www.w3.org/ns/prov#value> "For this purpose, many types of packaging have been developed, including ???flip-chip???, ball grid array and leaded grid array among other mounting configurations." .