<http://webisa.webdatacommons.org/prov/26536812>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/104203271> .
<http://webisa.webdatacommons.org/104203271>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/104203271>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/104203271>	<http://www.w3.org/ns/prov#value>	"For this purpose, many types of packaging have been developed, including ???flip-chip???, ball grid array and leaded grid array among other mounting configurations." .