. . "ow of the contacts; FIG. 5 represents a cross-sectional view of another embodiment of the present invention including contacts made from a material other than solder and including solder alignment bumps prior to reflow of the solder bumps; FIG. 6 represents a cross-sectional view of the structure illustrated in FIG. 5 after reflow of the solder bumps; FIG. 7 a illustrates a cross-sectional view of" . .