<http://webisa.webdatacommons.org/prov/270972907>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/110744257> .
<http://webisa.webdatacommons.org/110744257>	<http://www.w3.org/ns/prov#value>	"The present invention relates to a semiconductor device and a method of fabricating a semiconductor device, and more particularly, it relates to a semiconductor device comprising a semiconductor chip including a circuit and a method of fabricating a semiconductor device." .
<http://webisa.webdatacommons.org/110744257>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/110744257>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/397891953>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/110744257> .