<http://webisa.webdatacommons.org/prov/358592509>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/111893145> .
<http://webisa.webdatacommons.org/111893145>	<http://www.w3.org/ns/prov#value>	"Openings 306 could be formed by etching or by a mechanical means such as stamping or drilling, and openings 306 can be performed in front side substrate 302 before substrate 302 is attached to wafer 300." .
<http://webisa.webdatacommons.org/111893145>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/111893145>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .