<http://webisa.webdatacommons.org/11489748>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<docstoc.com> .
<http://webisa.webdatacommons.org/11489748>	<http://www.w3.org/ns/prov#value>	"FIG. 11 is a plan view illustrating a state where the upper part is removed from the resin mold of the semiconductor device representing an embodiment 2 of the present invention;" .
<http://webisa.webdatacommons.org/prov/249871573>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/11489748> .
<http://webisa.webdatacommons.org/11489748>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .