<http://webisa.webdatacommons.org/116259219>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/116259219>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/116259219>	<http://www.w3.org/ns/prov#value>	"FIGS. 4A to 4C are a diagram showing schematically drawn step-sequential cross section structures obtained in a process in which the multilayered interconnection substrate according to the present invention is applied;" .
<http://webisa.webdatacommons.org/prov/29832434>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/116259219> .