<http://webisa.webdatacommons.org/prov/248349209>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/116437119> .
<http://webisa.webdatacommons.org/116437119>	<http://www.w3.org/ns/prov#value>	"Furthermore, FIGS. 18A and 18B are a side view and a rear view of an IC chip prior to a bonding step of an IC chip mounting method according to a prior art example for explaining the sixth embodiment." .
<http://webisa.webdatacommons.org/116437119>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/355160063>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/116437119> .
<http://webisa.webdatacommons.org/116437119>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.de> .
<http://webisa.webdatacommons.org/prov/250979933>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/116437119> .