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<http://webisa.webdatacommons.org/11917694>	<http://www.w3.org/ns/prov#value>	"ulation is preferably applied to the component by spraying, but immersion of the componentin the formulation is feasible.The etchant formulation is specifically designed to etch copper either in the presence of nickel or nickel alloys, or overcoated with noble metals such as porous gold and palladium." .
<http://webisa.webdatacommons.org/11917694>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .
<http://webisa.webdatacommons.org/prov/14684132>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/11917694> .