<http://webisa.webdatacommons.org/prov/353446690>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/120632416> .
<http://webisa.webdatacommons.org/120632416>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/120632416>	<http://www.w3.org/ns/prov#value>	"One aspect of the invention provides a chip-scale ball grid array package that permits mounting of components, such as capacitors and resistors, thereon." .
<http://webisa.webdatacommons.org/120632416>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .