<http://webisa.webdatacommons.org/prov/248779558>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/122668357> .
<http://webisa.webdatacommons.org/prov/248951341>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/122668357> .
<http://webisa.webdatacommons.org/122668357>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.de> .
<http://webisa.webdatacommons.org/122668357>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/122668357>	<http://www.w3.org/ns/prov#value>	"FIGS. 20A and 20B are a side view and a rear view of an IC chip prior to a bonding step of the IC chip mounting method according to the seventh embodiment." .